Semiconductor Contract Design Services

We specialize in designing, testing and delivering custom integrated circuits. We work with you during your development stage to turn your design ideas into custom IC solutions that will enable you to differentiate your product in the marketplace.

Design Stage Support Plan

  • Functional Design and Logic Design
  • Circuit Design and Verification
  • Physical Design
  • Physical Verification

Design services in

  • SoC, ASIC, FPGA, Mixed SignalAnalog, Transceiver chips for 130nm to 7nm

Customer support plan - How we work

  • Overseas design center
  • Contract engineer
  • Project based services

Semiconductor Assembly Test Packaging

Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, which is to place dies, or boards, inside of a protective package that provides connectors or pins for connecting to other devices. 

Type of Services

  • Die Production (supports 200mm, 300mm wafer technology)
  • Assembly Packaging
  • Testing, Packing, Delivery
  • Package Design

Product Application

  • Digital
  • Analog
  • Mixed Signal
  • High Voltage
  • RF SiGe
  • RF CMOS
  • CIS

Factory Certification

  • ISO9001
  • IATF16949
  • ISO13485
  • ISO14001
  • OHSAS 18001
  • QC080000

Packaging Technology

  • We support the following package technology: QFN, PGA, BGA, CSP, SOT, SOIC, eWLB, Bumping, SOIC, WLP.

Connect with the best contract manufacturing in Malaysia.

Contact us today and get a free quote.

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